Sản phẩm>>Thi công sàn chống tĩnh điện
Name: Sàn PVC chống tĩnh điện dạng cuộn EP233

Item Standard Test Value
Surface Resistance IEC1340-4-1/SJ/T11236-2001 10E6-10E9
Volume Resistance IEC1340-4-1/SJ/T11236-2001 10E6-10E9
Decay Time (5KV-500V) MIL-B-81705B/GJB2605-1996 <0.25s
Starting Voltage IEC1340-4-1/SJ/T11236-2001 <100V
Inflaming Retarding DIN4102/SJ/T11236-2001 <3s
Abrasion resistant JISA1453-19B/ST/T11236-2001 <0.01g/cm2
Density 1.55
Size(Packed by mat) Length 60cm*Width 60cm* Thickness 2mm,3mm
Size(Packed by roll) Length 20m*Width 1.5m,2m* Thickness 2mm,2.5mm


1. Precondition:
1.1 ESD PVC floor ground construction includes groundsill checking, ground touch
system installing, glue configuration, tile laying cleanout test and quality inspection of
1.2 Temperature of construction surrounding should be 10~35;relative humidity
shouldn`t exceed 80%;construction place should be drafty. Basically,other projects of
the place should have been finished .
2. Material, equipment and tool
2.1 Material used for construction should conform to following requirements:
ESD PVC tiles: Physical capability and dimension should conform to requirements of
ESD PVC TILE GENERAL CRITERIONSJ/T11236, and its ESD function should be
permanent.Surface resistance should be 1.0x106—1.0x109.
Conductive Glue: should be of non-water-solubility, resistance should be less than
tiles, and sticking intensity should be more than 3x106 N/M2
Welding rod: surface color should be of equality, exterior diameter shoud be kept
consistent and material should be soft.
Copper foil: thickness shouldn`t be less than 0.025mm
2.2 Warehouse for placing tiles should be clean dry and drafty, perfect isolation from acid
alkali and other corrosive substances. When moving , load and discharge should be done
carefully against bouncing, and do not put tiles outside exposing to rain or sun.
2.3 Usual equipment for construction (tools inclusive) should includes notching machine,
welding torch, rubber hammer, knife, rule, brush, waxing machine and so on, all of which
capability and technique parameter should conform to technics requirement of
3. Construction Preparation:
3.1 Reconnaissance of construction place
3.2 Make blue print for construction , drawings of ESD Ground Touch System Ground touch
port and Ground web chart.
3.3 All materials , equipments , tools should be well prepared
3.4 Demonstration should be done before formal construction when construction floor
exceeds 140 sqm.
3.5 Construction Scene should conform to following requirements:
When floor of roots is of cement or water mill:
1) Reminders on floor such as paint and bond should be scraped clean
2) Floor should be surely flat , fissure or any accidented must be flated.
3) Floor should be surely dry, moisture-proof should be done previously in case of low
4) Floor surface should be rigid enough against loosen grits, and the intensity shouldn`t be
lower than NO. 75
When floor of roots is boards(wooden boards, ceramic tiles, plastics,e.g), original floor
should be of backout, and reminders on it should be cleaned quite.
Illumination device should configurated in construction scene.
3.6 Confirm position of ground touch port: port should be more than 1 pc in 100 sqm; 1-2 pcs
ports should be added when every 100sqm increased.
3.7 Floor should be cleaned quite before construction , and make sure no reminder such as
dust and dirt.
4. Construction:
4.1 Set datum line properly according to geometry frame of the room.
4.2 Copper foil should be laid as Ground Web Chart. Copper foils junction should be the
centre of every tile. Copper foil laid should be flat straight---no curl no gap. Copper foil
which contacts Ground Touch Port should be long enough .
4.3 Configuring conductive glue: fully mix glue with carbon powder by proportion 100:1
4.4 Glue brushing: glue should be brushed separately on the floor and copper foil laid, the
brushing should be full and consistent. Just let all this dry by airing when done.
4.5 Tiles laying: this should begain when floor brushed is dry and not sticky to hands. When
laying, both sides of tiles should be parallel to datum line and also action should be swift:
consistent gap of 1-2mm should be left between each tile; keep checking when laying ,
knock each tile with a rubber hammer to make sure it sticked strongly, and edges of floor
should be patched by tiles cutted properly.
4.6 When tiles laying comes to ground touch port, firstly lead out the copper foil which is due
to connect port, secondly connect it with the port strongly by welding or pressing, and
then go on laying.
4.7 When whole laying is finished, make notches along gap between two tiles with a notch
machine. Notch line should be straight flat and consistent, width shall be 3±0.2mm.
4.8 Start welding along the notch with a welding torch to connect tiles into a whole. And
redundants after welding should be scraped with a sharp knife, but should not hurt tile
4.9 Ground touch system process should includes conductive glue brushing, copper foil web
laying, copper foil laying for connecting ground touch port, ground touch port, earth wire,
grounding device.e.g.
4.10 When flooring construction is done, floor surface should be cleaned, and coated with
ESD wax for protection.


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